YOU ARE HERE >
HOME >
DIAMOND SEGMENT
Common problems and treatment methods of diamond segment
Publish Date:2020-08-17
There are several kinds of product quality problems in the production process of diamond segment:The size does not meet the requirements, the density is not enough, the hardness does not meet the requirements, there is debris in the transition layer, and the strength is not enough.
1. Diamond segment size does not meet the requirements
It is mainly because the pressure is not enough, or the sintering temperature is too low, or the heat preservation and holding time are too short during the sintering, so the diamond segment cannot be flattened, and the diamond segment height is too high; or the indenter size does not meet the requirements. Make the sintered diamond segment too high or too short;
To prevent this problem, the hot pressing parameters must be set correctly. At the same time, workers need to be careful when loading materials to prevent the wrong graphite mold, otherwise the sintered diamond segment may be scrapped and cannot be burned back.
2. Insufficient density and hardness does not meet the requirements
This problem is generally caused by problems in the design of hot-pressing parameters. Such as the design of sintering temperature and holding time is unreasonable make the hardness of the diamond segment is too low or too high which can’t exert the normal performance of the saw blade.
Therefore, the old formula can be sintered according to the previous hot-pressing parameters; for the new formula, not only the theoretical hot-pressing parameters must be inferred, but also appropriate adjustments must be made according to the sintering situation of the first mold to explore the correct hot-pressing parameters.
3. Diamond segment strength not enough
There are two main reasons for the insufficient strength of the diamond segment: 1. The inside of the diamond segment is mixed with impurities, such as graphite particles during mixing raw material; 2. The diamond segment formula design is unreasonable, or the sintering process is unreasonable, resulting in the weak strength of the working layer and the transition layer; the working layer and the transition layer are not strong enough, which causes the diamond segment to be disconnected from the connection between the working layer and the transition layer when the diamond segment is used or the diamond segment is pulled. Generally speaking, the formula of the working layer and the transition layer are the same, but in order to reduce the cost, the diamond segment is generally made of cheap cobalt-free Fe-bond. However, in order to ensure the welding strength, the transition layer formula needs to add an appropriate amount of cobalt, which causes the working layer and the transition layer formula to be different, making their thermal expansion coefficients different, and causing residual shrinkage at the junction of the working layer and the transition layer when the diamond segment cooling, make the strength decrease.
To solve this problem, we must first ensure that the powder is clean and free of dirt; in addition, in order to improve the welding strength of the diamond segment working layer and transition layer, when using transition layers of different formula, it should be considered that elements with similar thermal expansion coefficients are used.
Tags:
RETURN
The control ratio of the metal content in the diamond segment bond
2020-08-17
The diamond segment is composed of two parts of the bond and the diamond, and the bond is actually not just one component, it is made of paraffin, nickel, tin, zinc, copper, iron, silicon carbide, tungsten and other metal powders, and non-metallic powder, in which copper, iron, silicon carbide and tungsten are the main components, while nickel, tin, and zinc are the metal binders, which make the diamond and the bond more firmly....
Selection of diamond powder for diamond segment
2020-09-24
During the diamond segment working process, the role of diamond powder crystals is very important, especially in the cutting process, a good crystal can be very good in anti-breakage ability, reduce the power consumption of the equipment, and extend the life of the cutting....
Arrayed diamond segment and the saw blade
2020-12-29
In traditional diamond segment products, the diamond powder in the segment is arranged in disorder. During the cutting process, the exposed diamond will impact the stone surface at various angles, and the exposed height of the diamond will vary. As a result, the diamond is not evenly stressed, and diamonds with high exposure are prone to fracture. In order to improve this situation and make the diamond distribution more uniform, arrayed segments have emerged. Weld the arrayed segment on the blade steel body to be an arrayed saw blade....
Commonly used bond for diamond segment
2020-09-09
There are four commonly used bonds for diamond segment. These four bonds are matched with different diamond powders according to different materials to make diamond segments for different purposes. Each bond has its advantages and disadvantages. In the process of designing the diamond segment, we must take advantage and reinforce its shortcomings. This is the charm of diamond segment production and design....
Common problems and treatment methods of diamond segment
2020-08-17
Diamond segment is a non-standard industry in modern industry. The instability of product quality is the most common problem. The following are some of the most prone problems and related solutions in producing diamond segments. Through these instructions, Let everyone better understand the details of diamond segments production process....
Formula design of diamond segment
2020-10-16
Diamond segment is a very special segmented product. Through different formulas and different processes, products with different appearances, different cutting performances and different cutting life can be produced. The most attractive part of this product is that it is not Certainty, especially the new formula, needs to consider factors such as the object to be processed, the matrix metal bond, diamond grade and particle size, pressure and sintering temperature....
